15 January 2020
Cadence Design Systems is expanding its collaboration with Broadcom for the creation of semiconductor solutions targeting next-generation networking, broadband, enterprise storage, wireless and industrial applications
Building upon successful 7nm designs, Cadence and Broadcom are looking to expand the collaboration to include the creation of 5nm designs using Cadence digital implementation solutions. Using these solutions Broadcom can further augment engineering productivity and improve silicon performance and power.
“As a global infrastructure technology leader, we’re committed to delivering innovative products that enable our customers to excel in their respective markets,” said Yuan Xing Lee, vice president and head, Central Engineering at Broadcom. “With Cadence as a key silicon design partner, we’re able to achieve our power and performance goals and provide our customers with the highest quality solutions that they’ve come to expect from us.”
“We’ve collaborated with Broadcom for many years, and our expanded partnership on advanced-node design development is a result of the series of successes we’ve had together over time and our overall digital technology leadership,” said Dr. Anirudh Devgan, president of Cadence. “Given the continued proliferation of networking, broadband, enterprise storage, wireless and industrial applications, we’re dedicated to ensuring that Broadcom achieves design excellence using our latest toolsets to fuel design innovation.”
The Cadence digital implementation solutions are part of the broader digital suite, which provides optimal power, performance and area (PPA) and reduced turnaround time. The tools support Cadence’s Intelligent System Design strategy, which enables systems and semiconductor companies to achieve system-on-chip (SoC) design excellence more efficiently.
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Read more here: New Electronics News