Concerned that Apple’s 2017 iPhone lineup will come with “revolutionary features,” non-Apple companies have adopted a wait-and-see approach when it comes to chip orders.
As DigiTimes explains:
Fabless firms including MediaTek and HiSilicon continue to slow down their pace of orders, said the sources, which warned of disappointing handset-chip shipments from the non-Apple camp in the third quarter …
In addition, Taiwan Semiconductor Manufacturing Company (TSMC) has seen its non-Apple customers express more interest in the foundry’s 12nm node manufacturing, an enhanced version of its 16nm process technology, than its 10nm process, the sources said. The upcoming iPhone series is set to feature Apple’s A-series chips built using TSMC’s 10nm process technology.
Apple’s iPhone 8 is likely to feature the first design change for the company’s flagship device since the iPhone 6 launched in 2014. The 5.8-inch device could include a near-bezel-free design with a glass back, stainless steel frame, and 3-D camera capabilities on the front and back, and more.
The handset could be announced as early as Sept. 5, although persistent rumors continue to suggest production issues could push the launch into October or November.
Besides the iPhone 8, Apple’s also expected to announce a 4.7-inch “iPhone 7s” and 5.5-inch “iPhone 7s Plus” this fall.
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